Request for Proposal ListingsBYU Electrical & Computer Engineering Capstone Program (2026–2027)

BYU Electrical & Computer Engineering Capstone Program (2026–2027)

Brigham Young University (BYU)
BYU Electrical & Computer Engineering Capstone Program (2026–2027)
09/03/2026 to 04/15/2027
Brady Davies
Collaboration Overview
About Students
These students are in the final year of their Electrical or Computer Engineering bachelor’s degree at BYU. They bring hands-on experience with: 
  • Digital and analog circuit design
  • Embedded systems and firmware
  • Signal processing and filtering
  • Microcontroller and FPGA programming
  • PCB layout and fabrication
  • Control systems and sensor integration
  • Wireless communication protocols
  • Software development in C/C++, Python, and MATLAB
Each team operates within a project-based learning environment, applying engineering principles in a structured design process guided by experienced faculty.
About Program Goals
Capstone students will: 
  1. Define engineering requirements from a sponsor-defined problem statement
  2. Design, simulate, and implement circuit- or system-level solutions
  3. Integrate hardware and software into functional prototypes
  4. Perform validation through measurement, simulation, and debugging
  5. Communicate designs through schematics, code documentation, and final reports
  6. Develop readiness for careers in electrical, computer, and systems engineering roles
About the Collaboration Format
The Manufacturing Track of the BYU Mechanical Engineering Capstone Program offers organizations the opportunity to collaborate with a senior engineering team on real-world challenges focused on production systems, factory layout, automation, quality control, and cost reduction. 

This is a hands-on, year-long consulting engagement that results in tangible process improvements, documentation, and implementation-ready recommendations. Projects are supported by both faculty advisors and experienced industry coaches. 


Benefits to Sponsors: 
  • Solve real production, tooling, process, or quality challenges using engineering best practices
  • Unlock cost savings, productivity gains, or throughput improvements
  • Gain access to BYU’s engineering design and prototyping facilities
  • Engage with a dedicated team of talented, job-ready engineers
  • Present your company at BYU’s Capstone Design Fair for visibility and recruiting
  • Receive professional-grade deliverables, including root cause analysis, 3D models, simulations, and SOPs
Benefits for Industry Partners
Innovation & Problem Solving 
  • Tackle engineering challenges cost-effectively
  • Explore new product ideas without internal capacity strain
  • Leverage students’ creativity and fresh perspective
Access to BYU Engineering Talent
  • Evaluate potential future hires over an 8-month collaboration
  • Strengthen your university recruiting pipeline
Professional Deliverables (depending on track)
  • Prototypes
  • CAD models, documentation, and test results
  • Manufacturing simulations or process maps
  • PCB layouts, embedded systems, or firmware
  • Security assessments, penetration tests, and risk analyses
  • Full technical reports
  • Final presentation at Capstone Design Fair
Brand Exposure
  • Visibility at the Annual BYU Capstone Design Fair
  • Opportunities to highlight your organization’s innovation work
  • University-wide recognition
Program Details

Students Include: Bachelor Degree

Students Enrolled:  Students Enrolled

Program Duration: 32 weeks

Program Launch Date: 09/03/26

Program End Date: 04/15/27

Student Commitment: 8-13 Hours hrs/week

Course Format: Capstone, Multiple Projects Multiple Teams

Modality: Fully Remote

# of Projects: 50

View All Program Details

Project Requirements

Industry Partner Requirements
Project Topics Artificial Intelligence & Machine Learning Cybersecurity Data Management Electrical Engineering Information Technology (IT) Innovation Operations Product Design & Development Quality Control Research & Development Research, Analysis, Evaluation Software Design & Development Strategic Planning UX/UI & Human-Centered Design
Location Preferences

Located Anywhere

Compensation

No Compensation Required

Sponsorship

Sponsorship Requested (Mandatory):
Other Requirements
Sponsorship Fee: $22,000 per project (Covers faculty support, materials, software licensing, and lab access)
Sponsors retain ownership of IP and deliverables
Projects must include a technical challenge in design, implementation, or validation of ECE systems
Sponsor must assign a technical point of contact

Final deliverables include:
  • Design files (schematics, PCB layout)
  • Source code
  • Final prototype (if applicable)
  • Test plan and report
  • Presentation at the Capstone Design Fair
Project Management Time Commitment 2 Hours per week
Interested Industries Aerospace & Defense Agriculture & Farming Arts & Recreation Biotech & Pharmaceuticals Computers & Hardware Construction, Repair & Maitenance Consulting & Professional Services Consumer Products & Services Education & Ed-Tech Energy & Utilities Fashion & Apparel Finance & Investment Food & Beverage Government Health Care & Life Sciences Insurance Manufacturing & Industrial Media, Publishing & Content Natural Resources Non-Profit & Social Impact Public Works Real Estate Restaurants, Hospitality & Food Service Retail & E-Commerce Semiconductor Software, AI & Data Sports & Entertainment Sustainability & Climate Telecommunications Transportation & Logistics Travel & Tourism
Skills & Expertise
Analog Signal Processing C Programming C++ Programming Circuit Design Control Systems Data Acquisition Digital Logic Embedded Systems Engineering Communication FPGA Design LabVIEW MATLAB Microcontroller Programming PCB Fabrication PCB Layout Power Electronics Project Management Python Schematic Capture Sensor Integration Simulation Tools Simulink System Modeling Technical Documentation Testing and Debugging Wireless Communication
Key Program Dates Due Date
Projects Finalized

 Aug 01 2025
Student Teams Finalized

 Aug 22 2025
Application Deadline

 Jul 20 2026
Projects Launch

 Sep 04 2026

* We’ve got some inspirational project ideas below! These are related project topics that you can mix and match the components for the best cross-functional project experience possible.

See Examples

Artificial Intelligence & Machine Learning

See Examples

Cybersecurity

See Examples

Data Management

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Electrical Engineering

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Information Technology (IT)

See Examples

Innovation

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Operations

See Examples

Product Design & Development

See Examples

Quality Control

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Research & Development

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Research, Analysis, Evaluation

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Software Design & Development

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Strategic Planning

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UX/UI & Human-Centered Design

Program Overview
Program Title BYU Electrical & Computer Engineering Capstone Program (2026–2027)
Organization Brigham Young University (BYU)
# of Students Enrolled
0
# of Projects Running
0 Project/s Added (of 50 Projects Expected)

Program Timeline

Project Duration

Start Date: 09/03/26      End Date: 04/15/27

7 months
Collaboration Overview
About Students

These students are in the final year of their Electrical or Computer Engineering bachelor’s degree at BYU. They bring hands-on experience with: 
  • Digital and analog circuit design
  • Embedded systems and firmware
  • Signal processing and filtering
  • Microcontroller and FPGA programming
  • PCB layout and fabrication
  • Control systems and sensor integration
  • Wireless communication protocols
  • Software development in C/C++, Python, and MATLAB
Each team operates within a project-based learning environment, applying engineering principles in a structured design process guided by experienced faculty.

Student Level:   Bachelor Degree

Student Time Commitment:   Full Time

Team Structure:   5 - 7

Program Goals
Capstone students will: 
  1. Define engineering requirements from a sponsor-defined problem statement
  2. Design, simulate, and implement circuit- or system-level solutions
  3. Integrate hardware and software into functional prototypes
  4. Perform validation through measurement, simulation, and debugging
  5. Communicate designs through schematics, code documentation, and final reports
  6. Develop readiness for careers in electrical, computer, and systems engineering roles
Format Structure

Multiple Projects Multiple Teams
Format Title Capstone
Format Description
The Manufacturing Track of the BYU Mechanical Engineering Capstone Program offers organizations the opportunity to collaborate with a senior engineering team on real-world challenges focused on production systems, factory layout, automation, quality control, and cost reduction. 

This is a hands-on, year-long consulting engagement that results in tangible process improvements, documentation, and implementation-ready recommendations. Projects are supported by both faculty advisors and experienced industry coaches. 


Benefits to Sponsors: 
  • Solve real production, tooling, process, or quality challenges using engineering best practices
  • Unlock cost savings, productivity gains, or throughput improvements
  • Gain access to BYU’s engineering design and prototyping facilities
  • Engage with a dedicated team of talented, job-ready engineers
  • Present your company at BYU’s Capstone Design Fair for visibility and recruiting
  • Receive professional-grade deliverables, including root cause analysis, 3D models, simulations, and SOPs
Benefits For Industry Partners
Innovation & Problem Solving 
  • Tackle engineering challenges cost-effectively
  • Explore new product ideas without internal capacity strain
  • Leverage students’ creativity and fresh perspective
Access to BYU Engineering Talent
  • Evaluate potential future hires over an 8-month collaboration
  • Strengthen your university recruiting pipeline
Professional Deliverables (depending on track)
  • Prototypes
  • CAD models, documentation, and test results
  • Manufacturing simulations or process maps
  • PCB layouts, embedded systems, or firmware
  • Security assessments, penetration tests, and risk analyses
  • Full technical reports
  • Final presentation at Capstone Design Fair
Brand Exposure
  • Visibility at the Annual BYU Capstone Design Fair
  • Opportunities to highlight your organization’s innovation work
  • University-wide recognition
Project Modality Fully Remote
Industry Partner Requirements to Participate
Project Topics Artificial Intelligence & Machine Learning Cybersecurity Data Management Electrical Engineering Information Technology (IT) Innovation Operations Product Design & Development Quality Control Research & Development Research, Analysis, Evaluation Software Design & Development Strategic Planning UX/UI & Human-Centered Design
Target Industries Aerospace & Defense Agriculture & Farming Arts & Recreation Biotech & Pharmaceuticals Computers & Hardware Construction, Repair & Maitenance Consulting & Professional Services Consumer Products & Services Education & Ed-Tech Energy & Utilities Fashion & Apparel Finance & Investment Food & Beverage Government Health Care & Life Sciences Insurance Manufacturing & Industrial Media, Publishing & Content Natural Resources Non-Profit & Social Impact Public Works Real Estate Restaurants, Hospitality & Food Service Retail & E-Commerce Semiconductor Software, AI & Data Sports & Entertainment Sustainability & Climate Telecommunications Transportation & Logistics Travel & Tourism
Skills & Expertise Analog Signal Processing C Programming C++ Programming Circuit Design Control Systems Data Acquisition Digital Logic Embedded Systems Engineering Communication FPGA Design LabVIEW MATLAB Microcontroller Programming PCB Fabrication PCB Layout Power Electronics Project Management Python Schematic Capture Sensor Integration Simulation Tools Simulink System Modeling Technical Documentation Testing and Debugging Wireless Communication
Location Information & Preferences

Located Anywhere

  • Projects can be sponsored from anywhere
  • Sponsors are expected to join virtual kickoff and check-ins (monthly) and attend the final design fair in person or virtually
  • BYU teams will operate from campus, utilizing in-person collaboration and on-site fabrication facilities
  • Sponsors should be available for questions, feedback, and milestone reviews (1–2 hours/month expected)
  • Project-specific visits or site tours are optional but welcome if geographically feasible
Sponsorship

Sponsorship Requested (Mandatory):
Compensation

No Compensation Required
Other Requirements
Sponsorship Fee: $22,000 per project (Covers faculty support, materials, software licensing, and lab access)
Sponsors retain ownership of IP and deliverables
Projects must include a technical challenge in design, implementation, or validation of ECE systems
Sponsor must assign a technical point of contact

Final deliverables include:
  • Design files (schematics, PCB layout)
  • Source code
  • Final prototype (if applicable)
  • Test plan and report
  • Presentation at the Capstone Design Fair
Expected Time Commitment For Project Managers 2 Hours per week
Key Program Dates Due Date
Projects Finalized

 Aug 01 2025
Student Teams Finalized

 Aug 22 2025
Application Deadline

 Jul 20 2026
Projects Launch

 Sep 04 2026
Brady Davies
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