ProgramsBYU Engineering Capstone Program (2026–2027)

BYU Engineering Capstone Program (2026–2027)

Program Overview
Program Title BYU Engineering Capstone Program (2026–2027)
Organization Brigham Young University (BYU)
# of Students Enrolled
0
# of Projects Running
0 Project/s Added (of 50 Projects Expected)

Program Timeline

Project Duration

Start Date: 09/02/26      End Date: 04/14/27

7 months
Collaboration Overview
About Students

All Capstone students are in the final year of their accredited undergraduate programs. Across all tracks, they bring: 
  • Expertise in engineering fundamentals, applied mathematics, and systems thinking
  • Hands-on experience with design, modeling, prototyping, fabrication, and testing
  • Ability to scope ambiguous problems and translate them into engineering requirements
  • Training in professional communication, project management, and technical reporting
  • A strong work ethic grounded in BYU’s mission of learning, service, and engineering for good

Teams are comprised of students from various and multiple engineering disciplines as project relevant including:
  • Mechanical Engineering
    CAD (SolidWorks), thermodynamics, materials, mechanics, prototyping, systems design, mechatronics.
  • Manufacturing Engineering 
    Lean, Six Sigma, automation, quality, DFM/DFA, SPC, process design, workflow optimization.
  • Electrical & Computer Engineering
    Embedded systems, PCB design, signal processing, control systems, firmware, wireless systems.
  • Cybersecurity Engineering
    Pen testing, incident response, digital forensics, network security, GRC, IAM, red/blue teaming.

Student Level:   Bachelor Degree

Student Time Commitment:   Full Time

Team Structure:   5 - 7

Program Goals
Industry partners benefit from a rigorous, structured engineering experience where students: 

  • Apply the full engineering design and/or cybersecurity lifecycle
  • Develop prototypes, digital twins, risk assessments, and validated system improvements as project-appropriate
  • Use BYU’s machine shops, labs, test equipment, simulation tools, and fabrication resources
  • Collaborate with sponsors to iterate toward high-quality solutions
  • Produce deliverables that are professional, actionable, and implementation-ready
  • Build technical and soft skills required in modern engineering roles
Format Structure

Multiple Projects Multiple Teams
Format Title Capstone
Format Description
Team Structure: 
  • 1 team of 5–7 senior students
  • Guided by a faculty coach and BYU engineering staff
  • Supported by industry liaisons from the sponsoring organization
Engagement Expectations: Sponsors typically commit ~1 hour/week for guidance and feedback.  Student teams meet independently 8–10 hours per week.

Process:
  1. Problem Definition & Requirements
  2. Concept Exploration & Modeling
  3. Design & Development
  4. Prototyping / Testing / Validation / Analysis
  5. Iteration & Integration
  6. Final Documentation, Report, and Presentation
  7. Capstone Design Fair (Spring)
Benefits For Industry Partners
The BYU Engineering Capstone Program is a premier year-long applied innovation experience that engages senior engineering and cybersecurity students in solving meaningful real-world challenges. Each project is supported by faculty coaches, technical experts, and BYU’s extensive engineering facilities. 

Every project is staffed by a dedicated team of 5–7 senior students who operate like a professional engineering consulting group, designing, prototyping, analyzing, testing, validating, and documenting solutions that meet sponsor needs. 

Benefits for Participating Industry Partners include:

Innovation & Problem Solving 
  • Tackle engineering challenges cost-effectively
  • Explore new product ideas without internal capacity strain
  • Leverage students’ creativity and fresh perspective
Access to BYU Engineering Talent
  • Evaluate potential future hires over an 8-month collaboration
  • Strengthen your university recruiting pipeline
Professional Deliverables (depending on track)
  • Prototypes
  • CAD models, documentation, and test results
  • Manufacturing simulations or process maps
  • PCB layouts, embedded systems, or firmware
  • Security assessments, penetration tests, and risk analyses
  • Full technical reports
  • Final presentation at Capstone Design Fair
Brand Exposure
  • Visibility at the Annual BYU Capstone Design Fair
  • Opportunities to highlight your organization’s innovation work
  • University-wide recognition
Project Modality Fully Remote
Industry Partner Requirements to Participate
Project Topics Artificial Intelligence & Machine Learning Cybersecurity Data Management Electrical Engineering Entrepreneurship Information Technology (IT) Innovation Inventory Management Mechanical Engineering Operations Product Design & Development Purchasing, Logistics, Supply Chain Quality Control Reporting, Financial Planning & Analysis Research & Development Research, Analysis, Evaluation Sales & Business Development Software Design & Development Strategic Planning Sustainability & ESG Technology Commercialization UX/UI & Human-Centered Design
Target Industries Aerospace & Defense Agriculture & Farming Arts & Recreation Biotech & Pharmaceuticals Computers & Hardware Construction, Repair & Maitenance Consumer Services Education Energy & Utilities Fashion & Apparel Finance Food & Beverage Government Health Care Insurance Manufacturing Media Natural Resources Non-Profit Professional Services Public Works Real Estate Restaurants, Bars & Food Services Retail Semiconductor Software & IT Sports & Entertainment Telecommunications Transportation & Logistics Travel & Tourism
Skills & Expertise Automation C/C++ CAD (SolidWorks) Cloud Security CNC Communication Control Systems Data Analysis DFM/DFA Digital Forensics Documentation & Reporting Embedded Systems Fluid Mechanics FPGA Design Governance Risk & Compliance Identity & Access Management Incident Response LabVIEW Lean Log Analysis Machine Design MATLAB Mechatronics Microcontroller Programming Network Defense PCB Layout & Fabrication Penetration Testing Project Management Python Rapid Prototyping Red/Blue Teaming Risk Management Robotics Secure Coding SIEM Tools Simulation Tools Simulink Six Sigma SPC Stakeholder Engagement Systems Modeling Technical Writing Testing & Validation Thermodynamics Threat Modeling Vulnerability Assessment Wireless Communication
Location Information & Preferences

Located Anywhere

Sponsorship

Sponsorship Requested (Mandatory):

Pre-Revenue Startup an exact contribution amount of $22000.0

Growth Startup an exact contribution amount of $22000.0

Small to Medium Business an exact contribution amount of $22000.0

Large Enterprise an exact contribution amount of $22000.0

Government Organization an exact contribution amount of $22000.0

Non-Profit an exact contribution amount of $22000.0

Compensation

No Compensation Required

Other Requirements
Sponsorship Fee:  $22,000 per project (mandatory).
 
Covers: 
  • Faculty coaching and oversight
  • Student resources and tools
  • Materials, fabrication, prototyping
  • Testing and lab access
  • Program administration
  • Design Fair participation
Sponsor Responsibilities:
  • Define a challenge statement with BYU faculty
  • Assign a technical point of contact
  • Participate in milestone reviews, design reviews, and the final presentation
  • Maintain consistent communication
  • Provide timely feedback on deliverables
Intellectual Property:
Sponsors retain full rights to all deliverables, documentation, code, prototypes, and IP.
Expected Time Commitment For Project Managers 1 Hour per week
Key Program Dates Due Date
Finalize Project Details

Educators and Industry Partners finalize project charters, legal documents, and background materials.

 Aug 01 2025, 12:00.00 AM
Official Program End

We’ll find a time on this day for you to meet with the students to wrap up your project.

 Apr 14 2026, 12:00.00 AM
Proposal Application Deadline

Final date for Industry Partners to express interest in participating. 

 Jul 04 2026, 12:00.00 AM
Projects Launch

We’ll find a time on this day for you to meet with the students to kick off your project. 

 Sep 04 2026, 12:00.00 AM

Program Timeline

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